Zining Liu is currently pursuing his B.Eng. degree in Integrated Circuit Design and Integration Systems at the School of Electronic Science and Technology, Xiamen University, China. With a GPA of 3.80/4.00, he ranked first in his program during the postgraduate recommendation process and has been recommended for admission to Fudan University. He will join Prof. Qiuyang Lin’s research group as a master’s student in 2027.

During his undergraduate studies, Zining participated in projects involving emerging ferroelectric memory (FeFET) device modeling and simulation, legged-wheel robot control, and power-electronics system design. During an internship at the Shanghai Institute of Technical Physics, Chinese Academy of Sciences, he worked on capacitive transimpedance amplifier (CTIA) and operational-amplifier design and simulation. He received the National First Prize in the 18th Advanced Robotics and Simulation Technology Competition, the Provincial Second Prize in the 2025 National Undergraduate Electronics Design Contest, and an Honorable Mention in the Mathematical Contest in Modeling.

Zining is currently learning and exploring integrated circuit design—or, in his own words, “SPICE monkey-ing”—and hopes to design a chip of his own in the future. Outside his studies, he enjoys listening to music, running, reading, and playing badminton, although he still considers himself a beginner. He also values the continuing process of understanding himself and the world around him.